Sunnyvale, Calif.QuickLogic Corp. has started to package its QL8150 Eclipse II FPGA in a tiny 8-mm X 8-mm ball grid array (BGA) for portable applications such as smart phones, personal media players and industrial handheld products.
The thin fine-pitch BGA (0.5-mm) package has 196 balls in the 8-mm X 8-mm footprint. For rugged conditions, the QL8150's packaging supports the full industrial temperature range from −40° to +100°C. The package is only available lead free.
The Eclipse II family of FPGAs is designed with an architecture that features high performance logic, dedicated SRAM blocks, and a flexible clock architecture. Flexible programmable logic uses 0.18 m, six-layer metal CMOS process with densities ranging from 47 K to 320 K system gates. The devices feature standby currents as low as 14-µA.
"Providing our popular Eclipse II family in this small form factor packaging is another demonstration of our commitment to the handheld, portable market,” said Brian Faith, Sr. Product Marketing Director at QuickLogic, in a statement.
QuickLogic Eclipse II products in 8x8 mm packaging are available today. The pricing for the QL8150-6PUN196C will be less than $5, in high volume quantities, by the end of 2006.
For Eclipse II datasheets, click here: www.quicklogic.com/images/EclipseII_Family_DS.pdf
QuickLogic Corp., 1-408-990-4000, www.quicklogic.com.