Sunnyvale, Calif. OmniVision Technologies Inc. rolls out its OV3630DZL stacked die CameraChip solution at this week's 3GSM World Congress. Offering a drop-in solution, the device enables handset designers to upgrade camera phones from 2 to 3 megapixels without mechanical design changes.
The OV3630DZL is a stacked die camera module design with a 1/3.2-inch optical format and a module size of 9 x 9 x 7 mm. This module was developed specifically for handset designs that require very low power consumption.
The module consists of OmniVision's OV3630, a 3-megapixel CMOS image sensor, stacked on top of the advanced OV620 camera bridge processor. The camera bridge processor produces YUV output in various fully processed and encoded data formats, which is compatible with all common compression standards, said the company.
At 2.8-volt operation, the OV3630 sensor operates at 15 frames per second at full resolution, enabling the use of an electronic shutter instead of a traditional mechanical shutter. This reduces the mechanical envelope needed, said the company, allowing for faster adoption of 3-megapixel camera phones into the mainstream market.
In addition, the OV3630DZL camera is said to offer excellent resolution, light sensitivity, superior dynamic range and power efficiency in a small footprint. This is largely due to the integrated OmniQSP image processing block, which provides high-grade picture processing and offers features that are traditionally only found in digital still cameras.
The OV3630DZL also features many advanced functions such as image effects, edge enhancement, pixel correction, lens shading and other corrective technologies. The proprietary sensor technology uses advanced algorithms to cancel fixed pattern noise, eliminate smearing and significantly reduce blooming, said the company.
Samples are available for the OV3630DZL stacked die module. Pricing is $20 in sample quantities.
OmniVision Technologies, 1-408-542-3000, www.ovt.com