Eindhoven, NetherlandsRecognizing the need for greater electrostatic discharge (ESD) protection in mobile devices, particularly cell phones, Royal Philips Electronics has bolstered the HBM ESD rating of its Advanced Ultra-Low Power (AUP) logic device family to 5-kV from 2.5-kV.
The 74AUPxGxx AUP single, dual and triple gate logic CMOS chips, which are manufactured on its C75DM process developed in MOS-34, provide 2X the industry standard in ESD protection, according to Bruce Potvin, director of marketing, logic product line, Philips Semiconductors.
The company has released 42 devices with plans to have 55 by the end of this month, which is nearly 40% more than its nearest competitor, he added.
"We also have dual gate and triple gate functions in one package. We are the only one to offer that. Because they are used in portable applications, our power performance from an overall standpoint, our C &supPD; is about 20% better than our nearest competitor. And if you look at battery life at 1.8-V, which is where the family is optimized, is two times compared to ULP, which is an existing family out there," he said.
The battery life operating at 1.8-V in an AUP device is about 2400 minutes, vs. 1200 minutes in ULP parts, which are competitive products from Fairchild and Toshiba, he said. The AUP devices are offered in PicoGate, MicroPak and MicroPak II packages.
A closer look
The enhanced AUP products include translators, multifunction, configurable devices, and combination logic. Two of the translators Philips highlighted are its 74AUP1T34 dual supply buffer, its first single gate translation device, and the 74AUP1T45 dual supply transceiver.
"Nobody else offers the functionality of the 74AUP1T34. Why it's important to customers is their ASIC may be at 1.8-V and memory may be at 3.3-V, so they need to have a signal translator," he said.
Chip makers making ASICs and other digital products using 90-nm process technology have had a difficult time incorporating ESD protection in their silicon. Traditionally, customers have used ESD protection diodes; however, the need to reduce part count has accelerated the trend toward using logic to translate signals from .8-volts to 3 volts to 5-volts, Potvin explained.
Philips also emphasized its combination logic devices, which integrate two functions in one package. The parts include the 74AUP1G0832, 3-input AND-OR function, and the 74AUP1G3208, 3-input OR-AND function.
Features include low-voltage CMOS of 1.1-V to 3.6-V; high-noise immunity; Schmitt-trigger action on all inputs; and -40°C to +125°C operation. The 74AUP1T34 dual supply translator also features Ioff circuitry for partial power down.
Enhanced configurable devices include the 74AUP1G57 (AND gate) and 74AUP1G58 (OR gate) multifunction logic.
"What these parts offer the engineer is flexibility to design in four different functions in one chip without paying cost premium. It's a configurable architecture; because it's six pins, it allows the engineer the freedom to design in four different functions in one device, therefore having less inventory to carry and fewer products one their AVL," he said. "The functions are derivatives of the AND or OR function."
Both devices feature low-voltage CMOS of 0.8-V to 3.6-V; ±20-mA output drive; high-noise immunity; Schmitt-trigger action on all inputs; and -40° to +125°C operation.
All of the devices are suitable for laptop computers, mobile phones, PDAs, and handheld electronic equipment.
"The products have a lot of circuitry in a very small package, with very low power consumption the answer to miniaturization and portability," he said.
The devices range in price from 18 cents to 30 cents each.
Royal Philips Electronics, semiconductor division sales, 1-408-474-8142, www.semiconductors.philips.com.