Fullerton, Calif. TT electronics BI Technologies Electronic Components Division provides a space-saving termination for high-speed memory busses and decoupling for high-frequency data line drivers with the Model BB1110RC resistor-capacitor network.
The Model BB1110RC high-density flip chip BGA-mounted device includes nine 50 ohm resistors in series and nine X5R 0.1 microfarad/10-V chip capacitors in a center-bussed schematic, all integrated on a single substrate. Resistor tolerance is ±1%, capacitor tolerance is ±10%, and the temperature coefficient of resistance (TCR) is 200 ppm/°C. The resistor power rating is 0.05 W at 70°C, and the overall package power rating is 1.0 W at 70°C. The operating temperature range is -55°C to 85°C.
The two-sided networks feature solder balls on one side and components on the other side. Connection is achieved with solid-filled vias. The company said the unique network construction provides very low capacitance and inductance parasitics, which are required in high-speed applications.
The BGA network uses 27 high-temperature solder balls in a 3 x 9 array that will not collapse during board mounting, using industry-standard ball diameter and 1.0-mm pitch, according to the company. Overall package dimensions are 9 x 3 mm with a board-mounted profile of 2.40 mm. Click the link for the BB1110RC datasheet.
Typical pricing for the Model BB1110RC networks is $1.00 in medium range volumes, with lead times from stock to eight weeks.
BI Technologies, 1-714-447-2518, www.bitechnologies.com