Taipei, TaiwanVIA Technologies Inc. added another device to its Ultra Mobile PC (UMPC) product portfolio: the VX700 core logic chipset that integrates North and South Bridge functions into a flip-chip BGA package measuring 35-mm x 35-mm.
Yielding a more than 42% savings in board real estate, the VX700 single chipset is aimed at ultra small form factor devices such as thin notebooks and portable devices that require more simplified board layouts and expanded room for additional onboard features, as well as devices that offer high levels of power efficiency. The company claims that it is the first single chipset product for UMPCs.
VIA's other key UMPC products include the C7-M ULV processor, the VN800 digital media mobile chipset, and the VT8237A advanced chipset south bridge.
For more on VIA's UMPC products, click here: www.via.com.tw/en/products/ultra_mobile/
The VX700 delivers a TDP (Thermal Design Point) maximum of 3.5 watts compared with 4.4 watts, the power consumption level of VIA's VN800 and VT8237A. That's a 20% power savings over the equivalent two-chip chipsets.
Enhanced video quality is provided through the company's UniChrome Pro II IGP graphics core that offers 128-bit 2D/3D graphics. For power image enhancement technology, the VX700 chipset integrates a Chromotion Video Engine that delivers a Hi-Def visual experience, including advanced video acceleration for MPEG-2, MPEG-4, and WMV9.
The VX700 also features the company's memory controller technology that supports DDR and DDR2 memory (up to 533-MHz). It also offers high-speed 533/400MHZ FSB connections to the VIA's C7-M and C7-M ULV processors.
The VX700 is priced at approximately $35 each.
VIA Technologies Inc., 1 510-683-3300, www.via.com.tw