Fremont, Calif. SMART Modular Technologies' new CoolFlex DDR2 2GB dual-in-line memory module uses folded PCB technology to double memory capacity and eliminate the need for stacked or multi-die DRAMs.
Specifically designed to be cost-effective, the CoolFlex DDR2 2GB VLP RDIMM is aimed at mainstream blade-server, ATCA telecom, and network computing applications. The module is configured as 256Mx72 and uses mainstream standard 128Mx4 BGA DRAMs with a speed grade of 5300 (DDR2-400, 533, 667). The unit boasts of a very low profile of only 0.72-inch.
SMART's registered CoolFlex DDR2 DIMMs and FBDIMMs features an innovative foldable PCB technology. The benefits of this approach include twice as much surface area for high-density modules, a thermal aluminum core for optimized cooling, improved electrical performance with better timing margins, high durability and reliability, and the avoidance of stacked or multi-die DRAMs.
The units are targeted at space-constrained 1U and sub-1U blade server and network computing applications. The modules can be mounted vertically to save board space while still maintaining tight DIMM spacing to allow for proper system airflow.
The CoolFlex DDR2 2GB VLP 0.72" RDIMMs range in price from $415 to $430 in OEM quantities. Product availability is based on a 4 to 6 build-to-order schedule.
SMART Modular Technologies (978) 805.2164