Norwood, Mass. Advanced Thermal Solutions, Inc. (ATS) has announced that its maxiGRIP heat sink attachment system has passed Mil-STD-810 shock testing and unpackaged drop testing. Shock and vibration testing was performed and certified by National Technical Systems, Inc. (NTS).
The maxiGRIP system, for mounting heat sinks to a variety of integrated circuits (ICs), features a plastic frame clip that snaps securely around a component's perimeter with a stainless steel spring clip that runs though the heat sink's fin field and fastens securely to the plastic frame. This allows the heat sink to be mounted securely to the component with a steady, even pressure, said the company. The spring clip is easily removed to allow a heat sink to be detached and re-attached without damaging the component.
Unlike alternative screw-on or snap on attachment systems there is no chance of over- or under-tightening of the heat sink to the processor's surface or having the heat sink pop-out during transport, installation or shock and vibration, said the company. In addition, because there is no need to bore holes into the board to secure the heat sink, there is more space for circuit traces on the PCB.
In addition to Mil-STD-810 shock testing and unpackaged drop testing, NTS also tested and certified maxiGRIP in accordance with Telcordia GR-63-Core office vibration and ETSI 300019 transportation vibration standards. The maxiGRIP system is also compliant with NEBS standards and meets RoHS requirements. Click the link for more information about the maxiGRIP technology and heat sinks.
The maxiGRIP system is available for a wide range of heat sinks and component packages. Pricing is less than $8.00 in production quantities.
Advanced Thermal Solutions, 1-781-769-2800, www.qats.com