SANTA CRUZ, Calif. An on-line tool that provides a detailed simulation of how Vishay Siliconix MOSFETs will perform thermally is now available without charge. It claims to be the first such on-line tool to use finite element analysis for increased accuracy.
Vishay's new ThermaSim tool lets designers run thermal simulations before prototyping. It's powered by Rebecca 3D software from Epsilon Ingenierie. Vishay claims the tool is particularly useful in high-current, high-temperature applications such as automotive, telecom, desktop and laptop computing, and industrial systems.
By using structurally detailed models of Siliconix MOSFETs created using finite element analysis, ThermaSim claims to increase the simulation's accuracy. Designers may also define other heat-dissipating components and simulate their effect on the MOSFET's thermal operation. Designers can choose between steady-state and transient simulation.
To use ThermaSim, the designer provides pc-board size, layers, material, and copper spreading; sets pad size and solder quality; defines the heat sink size, material, and attachment methodology; and selects the power-dissipation profile, system temperature, air flow, and assembly orientation.
Simulation results are emailed directly to the designer and can be downloaded into Microsoft Excel. Thermal images are provided, and an MPEG video clip of the thermal image with transient simulation also is available.
Vishay Intertechnology is a manufacturer of discrete semiconductors and passive electronic components.