Irvine, Calif. Henkel has announced the commercial availability of a new non-conductive paste (NCP) underfill encapsulant for flip-chip image sensor applications. The Hysol FP5110 material is said to provide excellent adhesion to both 2- and 3-layer flexible printed circuits by bonding to both polyimide and epoxy adhesive material.
Like other materials in Henkel's NCP product portfolio, the Hysol FP5110 material provides an alternative to traditional, mechanical soldering by bonding bumps to the substrate through a lead-free compatible thermal compression process, which simplifies flip-chip assembly and eliminates the need for flux application, reflow and cleaning, said the company. In addition, the material may be used as a replacement for manual anisotropic conductive film (ACF) processes for image sensor assemblies.
Hysol FP5110 is compatible with thermal compression and ultrasonic bonding processes. It also features an energy-saving, low temperature 10-second SnapCure at 180°C, and storage requirements of -15°C which is said to help eliminate freeze thaw voids often associated with -40°C storage, said the company.
Henkel, 1-949-789-2500, www.henkel.com