Hackensack, N.J. Master Bond Inc. has successfully completed in use trial testing for its highly flexible EP21TDC-2AN thermally-conducting epoxy resin compound for high performance bonding, coating, and encapsulation. The two-component cured compound may be used in electronics, electrical, computer, metalworking, appliance, automotive and chemical industries.
Trial results indicate successful use of the EP21TDC-2AN in a number of demanding aerospace and chemical industry applications. Trials have also shown improved long-term performance compared to various other flexible compounds such as polysulfide compositions over a wide service temperature range of -185°C to 120°C. As a result, the EP21TDC-2AN compound is also recommended for cryogenic applications. It can also be used for bonding substrates with greatly different coefficients of expansion.
The EP21TDC-2AN epoxy resin compound exhibits a 31% elongation and a tensile shear of over 1070 psi. With very little exotherm developed during cure, the EP21TDC-2AN compound is suitable for potting and encapsulation in very thick as well as thin sectioned configurations.
The EP21TDC-2AN produces durable bonds to many different substrates including metals, glass, ceramics, wood, vulcanized rubber and many plastics. The hardened composition is a good electrical insulator with a volume resistivity of greater than 1012 ohm cm. In addition to high elongation and peel strength it is said to offer excellent thermal shock and chemical resistance including exposure to erosion from water, gasoline and numerous acids, bases and salts. Click the links for more information about the EP21TDC-2AN and other one or two-part epoxies.
Pricing is roughly $350 to $500 for minimal quantities. Discounts are available for volume purchases. It is available in premixed bi-packs and cartridge/guns as well as in pint, quart, gallon and 5-gallon container kits.
Master Bond, 1-201-343-8983, www.masterbond.com