Xilinx has announced volume production of its 90nm I/O optimized Spartan-3A platform. This includes both the 3S700A and 3S1400A devices with the balance of the platform to follow within the second quarter of this calendar year.
"By moving the Spartan-3A line into production volume within three months of introduction is a testament to the stability of 90nm technology and our commitment to quality," said Dan Lenahan, senior director of IC Development, General Products Division at Xilinx. "Our significant lead on the 90nm node has resulted in one of the fastest product ramps in company history and our customer base is thrilled with the results."
In a related announcement today, Xilinx introduced a new extension to its Spartan-3 generation, the Spartan-3AN family, which is claimed to be the industry's most advanced non-volatile FPGA solution. Built on the company's proven 90nm Spartan-3 low-cost FPGA fabric, the new platform combines the performance and functionality advantages of SRAM-based technology with reliable non-volatile flash technology in a single-chip solution.
Xilinx Spartan-3 generation devices, now consisting of four optimized platforms, provide over 80 percent of the world demand for high-volume 90nm FPGAs and can be found in a variety of consumer electronic and automotive applications, including digital displays, mobile phones, PDAs, rear-seat entertainment and satellite navigation systems.
About the Spartan-3A family
With the addition of an I/O-optimized platform, the Spartan-3 generation expands the billion-dollar global market for low-cost FPGAs targeting volume applications on the 'edge of the network' in the home, in the car and on the factory floor. The Spartan-3A platform consists of five devices offering up to 1.4 million system gates and 502 I/Os. Offering the lowest cost per I/O in the industry, the new family also features significant advances in power management, device configuration and design security.