Tokyo, JapanFDK Corp. has developed four multilayer chip baluns for WiMAX and Mobile WiMAX applications.
Baluns in the AMB1608C series, which consists of the 2500Z05, 2500Z10, 3600Z05 and 3600Z10 devices, measures 1.6x0.8x0.6 mm with low insertion loss of 0.6dB and frequencies of 2.5-GHz and 3.6-GHz.
The company said that the baluns can achieve low insertion loss in this package size due to its low temperature firing material and multilayer pattern techniques.
The multilayer chip baluns match impedance between equilibrium and non-equilibrium circuits in RF devices designed in WiMAX communications equipment such as mobile phones, PDAs, and car navigation systems.
The baluns comply with the European Union's RoHS Directives.
Samples of the AMB1608C series baluns will ship in April 2007.
FDK America, 408-432-8331, www.fdkamerica.com