San Jose, Calif.Aimed at fusion-sensing applications, Sensor Platforms Inc.'s SSP1401 multi-channel LRC sensor interface chip has six user-configurable I/O channels that can drive most types of sensor elements, including resistive, capacitive, inductive and piezo-resistive.
The SSP1401's six user-configurable channels can each drive up to 60 mA for any given sensor. The device can measure four major kinds of sensors: pulse count, inductive, capacitive and resistive sensors. Applications include pressure sensors, accelerometers, capacitive touch screens, MR magnetometers, microphones and thermal sensors.
According to Sensor Platforms, the SSP1401 is suitable for "deeply embedded" applications, which it describes as embedded products that are less reconfigurable than microcontrollers, but smaller and cheaper and designed to fill a specific product niche.
The SSP1401 employs a measurement technique to convert sensor values into digital results without the need for an A/D converter. The SSP1401 provides 1.8-V operation (1.6V to 3.6V) and low-power consumption of <0.5-mA (typical), making it a natural fit for any battery-powered mobile platform seeking to add more value by leveraging the capability of sensors.
It operates in the extended temperature range from -40° to +125°C for industrial and automotive applications.
Pricing: Packaged devices are priced at $2.24 each in 1000-unit quantities. An evaluation kit will be $199 each.
Availability: The SSP1401 is available in a bare die form or in a 5 x 5 mm, 28-pin MLF/QFN package that is RoHS compliant. Samples and evaluation kits will be available in the second quarter of 2007.
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Sensor Platforms Inc., (408) 850-9350, www.sensorplatforms.com