LONDON NXP Semiconductors is about to start sampling a single-package 81-pin TFBGA Wi-Fi chip that it says is the smallest device yet for 802.11 b/g connectivity as well as offering very low power drain.
Dubbed the GBM220, the device is targeted at feature phones and smartphones, handheld game consoles and PDAs and is scheduled for volume production by the fourth quarter of 2007.
The part, which builds on NXP's BGW211, integrates the RF and baseband/MAC functions in a 5mm x 5mm TFBGA package that supports the SDIO/SPI host interfaces.
NXP (Eindhoven, the Netherlands) is also bringing out reference designs using the BGM220 including NXP’s PMU for power management functionality and validated front-end modules through the company's partnership with selected module manufacturers.
The device meets key WFA interoperability requirements including WPA2 and WMM and supports all relevant enterprise security requirements with CCX extensions.
The BGM220 comes with driver support for all major operating systems, including Windows Mobile, Windows CE, Symbian and Linux, and is designed to support a single antenna for Bluetooth and WLAN.