Eindhoven, the NetherlandsAimed at handheld applications such as feature phones and smartphones, handheld game consoles and PDAs, NXP Semiconductor housed its latest WLAN chip in an 81-pin TFBGA.
Designated the BGM220, the WLAN chip includes the RF and Baseband/MAC functions in a single 5mm x 5mm TFBGA package that supports SDIO and SPI host interfaces. In addition to small packaging, the BGM220 offers low-power consumption, according to NXP.
The BGM220 builds on its predecessor, the BGW211, but uses the 802.11b/g WLAN standard to enhance user connectivity. The BGM220 also provides extended wireless access by enabling simultaneous Bluetooth and WLAN connectivity.
The BGM220 is designed to meet key WFA interoperability requirements including WPA2 and WMM and supports all relevant enterprise security requirements with CCX extensions.
The BGM220 comes equipped with driver support for all major operating systems, including Windows Mobile, Windows CE, Symbian and Linux, and is designed to support a single antenna for Bluetooth and WLAN.
The BGM220 will be available for sampling during the second quarter of 2007, and mass production will commence during the fourth quarter of 2007.
Pricing and datasheets are not yet available.
NXP Semiconductors, 1-800-447-1500, www.nxp.com