Orlando, Fla.Qualcomm Inc. plans to sample early next year a pair of modem chipsetsthe CSM8900 and MDM8900that support the forthcoming Ultra Mobile Broadband (UMB) standard.
Qualcomm's next-generation Cell Site Modem (CSM)
CSM8900 and Mobile Data Modem (MDM) MDM8900 modem chips will support the latest 3GPP2 UMB standard, expected to be finalized within the first half of this year.
UMB technology incorporates the benefits of OFDMA, CDMA and other air interface techniques with MIMO and advanced antenna technologies to offer features such as support for broadband speeds, greater capacity and coverage, and an enhanced user experience for future mobile services.
For more on UMB, go to www.cdg.org/technology/3g_umb.asp.
Qualcomm will present the industry's first over-the-air UMB demonstration in the Company's booth, #1645, at the CTIA Wireless 2007 conference in Orlando, Fla.
The MDM8900 will provide support for up to 40-Mbits/s on the downlink and 10-Mbits/s on the uplink. It will interface with the Mobile Station Modem (MSM) MSM7850 baseband chipset, creating a mobile device that takes advantage of new services enabled by UMB.
The CSM8900 cell site product features a single-sector architecture and leverages QUALCOMM's Snapdragon mobile broadband technology. The CSM8900 also supports 4x4 MIMO and serial input/output to help drive the deployment of next-generation wireless capabilities.
Sampling of the MDM8900 is scheduled for the first quarter of 2008, and sampling of the CSM8900 is scheduled for the second quarter of 2008.
Qualcomm Inc., 1-858-587-1121, www.qualcomm.com