Fort Washington, Pa. Kulicke & Soffa Industries, Inc. has released a new gold wire for stacked-die and multi-layer applications, and an ultra-soft copper wire for a variety of discrete and IC applications.
The Formax gold bonding wire is said to offer highly accurate and consistent loop profiles for higher wire bond yields. The Formax wire improves linearity and stability, while achieving higher molding results, said the company. This wire has versatile looping capabilities, with loop heights of less than 3 mil to more than 16 mil, with wire spans up to 320 mil using a 1-mil wire diameter wire.
The MaxSoft copper bonding wire offers unique physical properties that is said to reduce IC bond stress and significantly improve second bond strengths. Applications using copper wire for bonding can prove challenging since copper inherently deforms less readily than gold wire, causing higher stress on the bond pad. K&S laboratory results have shown that due to its lower wire hardness, MaxSoft reduces pad damage and provides stronger intermetallic connections, said the company.
In addition, MaxSoft obtained up to 35% higher second bond pull responses compared to conventional copper wire, with increased bonding robustness, said the company.
The MaxSoft copper bonding wire is available from 0.8- to 1.3-mil diameters and has a long shelf life of six months when stored in the recommended conditions inside the original packaging.
Product information: bonding wires
Kulicke & Soffa, 1-215-784-6000, www.kns.com