Austin, Tex. Austin Semiconductor Inc. has released the DDR2 SDRAM family of iPEM devices, which is packaged in a 32-mm x 25-mm, 255-ball BGA with a ball pitch of 1.27-mm.
The first member of the DDR2 SDRAM product offering is a 2.4-Gbit device, organized as a 32M x 72/80. It features a 667-Mbits/s transfer rate while operating within the Mil-Temperature range of "550° to +1250°C. The device will be joined by a 4.8-Gbit version in September of this year.
The DDR2 SDRAM product family is based on integrated multiple silicon devices, manufactured on an organic laminate micro-substrate and then encapsulated using industry-standard plastic materials (iPEM). The device has been defined with separate power and ground planes as well as planer assembly techniques for improved flexibility for signal filtering and improved thermal performance.
ASI supports the customer design in effort with full product AC/DC electrical specifications, IBIS models, package/laminate effects and a thermal analysis report. The product is available in RoHS and Pb metallurgical compositions.
Availability: Full production; currently being delivered to all speed variants, including DDR2-667-Mbits/s.
Datasheet: click here.
Austin Semiconductor Inc., 1-512-339-1188, www.austinsemiconductor.com