San Jose, Calif.The two latest members of Winbond Electronics Corp. America's SpiFlash 25X family of serial flash memories are available in production quantities.
The company also plans to introduce later this year a new class of high-performance serial flash memories.
The 16-Mbit W25X16 and 32-Mbit W25X32 SpiFlash memories are housed in a space-saving, cost-effective 8-pin SOIC package. The W25X16 and W25X32 SpiFlash memories employ the company's 0.13-um Winstack technology. They feature a Serial Peripheral Interface (SPI), supporting both Single-SPI and Dual-SPI operation.
The W25X16 and W25X32 also include uniform 4K-byte erasable sectors, in addition to earlier-generation 64KB blocks. The smaller 4K-byte sectors allow for efficient memory allocation and storage of data, and are required in many Intel-based PC applications.
Applications include desktop and notebook PCs, DVD players and recorders, WLAN and DSL equipment, digital TVs, set-top-boxes, printers, and industrial-control systems.
"Serial flash offers considerable advantages in pin-count, space and system cost, compared to parallel flash," said Robin Jigour, vice president of Serial Flash marketing at Winbond America, in a statement. "However, slower transfer rates have limited their acceptance in some applications. The Dual-SPI feature is an effective first step but much higher performance is still needed before serial flash can overcome the performance advantages of parallel flash memories."
"To address this need, Winbond will introduce a new class of high-performance serial flash memories later this year. The new family features Quad-SPI with six times the transfer rate of standard serial flash and greater performance than most parallel flash memories. This new line is targeted at applications that execute code directly from the SPI bus to significantly reduce system costs. Winbond will initiate this Quad-SPI family with a 16-megabit flash memory."
Pricing: email Winbond's Flash marketing group at email@example.com.
Availability: The W25X16VSSIG (208mil SO8) and W25X32VSSIG (208mil SO8) are now in volume production. Alternate packages, including 16-pin SOIC, 8-pad WSON, 8-pin DIP and Known Good Die (KGD) on wafer, will also be supported.
Datasheet: click here.
Winbond Electronics Corporation America, 1-800-677-0769 or 1-408-943-6666, www.winbond.com