LONDON Samsung, TSMC, Intel, Toshiba, and UMC had the five largest shares of the world's chip manufacturing capacity at the end of 2006, with a combined capacity of just over 2.9 million 200-mm equivalent wafer per month. They accounted for 32 percent of total wafer capacity as of year-end 2006, according to market research company IC Insights.
At the same time, nearly 48 percent of the world's capacity was represented by the combined capacity of the top ten chip companies, the researcher said.
Geographically, the top-10 capacity leaders represent a diverse group with three based in Taiwan, two in South Korea, two in the United States, two in Japan, and one in Europe. Two of the largest capacity holders are the pure-play foundries, TSMC and UMC.