Austin, Tex. A 0.8-mm pitch Type IV open top BGA test and burn-in socket family from 3M Electronic Solutions Division handles up to 961 leads. The 3M Textool brand test and burn-in socket line is designed for burn-in, low-speed testing and programming of semiconductors.
The open top BGA test and burn-in socket accepts BGA packages on 0.8-mm pitch, with body sizes up to 27 x 27 mm and grid arrays up to 31 x 31. It uses the same dual-beam contact system technology as 3M's existing open top BGA sockets, and the new design provides a balanced contact in the top hemisphere of the solder ball, which reduces shear stress on the solder ball and minimizes package shift during actuation. This minimizes chances for ball damage during burn-in while optimizing automated insertions.
The test and burn-in socket line also features a unique micro-wiping contact that scrubs the oxide layer of the solder ball as well as the surface of the socket contact with each actuation to extend the socket's life cycle.
Availability: Production volume is available now.
Product information: BGA sockets
3M Electronic Solutions Division, www.3m.com/electronics