Corpus Christi, Tex. The TFC series of solderable thick-film copper substrates from TT electronics IRC Advanced Film targets high-current and power module applications. Delivering high-current carrying capability and excellent thermal characteristics, the copper substrates are suitable for a variety of power applications where a significant amount of current is required such as thermo-electric coolers and power modules.
The patented copper formulation uses a screen-printing process where the copper traces are printed on an alumina ceramic substrate and fired at temperatures up to 1000°C.
The substrates feature an adhesive copper strength of >20N/mm2, thermal expansion of 7.3 ppm/°C, very low thermal impedance, and sheet resistivity of 0.2 mΩ/square (180 microns thick). Conductor thickness ranges from 20 to 250 microns, with a minimum conductor width and space between conductors of 0.5 mm.
When integrated onto the substrate, the resistors feature an ohmic range down to 0.001 Ω, with tolerances to ±1%, suitable for current sensing or high power dissipation. The substrates are available in thicknesses ranging from 0.25 mm to 1.0 mm, and sizes up to 4.5 in. x 6.25 in. They can be laser-scribed or green-scored.
Product information: power resistors
IRC Advanced Film Division, 1-361-992-7900, www.irctt.com