Napa, Calif. Royce Instruments has introduced the System 650 universal bond tester with quick-start test modules that permit rapid changeover between wire pull, tweezer pull, ball bond shear, cold ball pull or die shear tests.
All interchangeable test modules can be range selected over a broad scale, permitting measured force resolution of less than 1 milligram. Calibration accuracy between different machines is maintained within overall system accuracy of 0.15%. The System 650 conforms to SEMI S2 ergonomic standards with joystick controls and "one touch" motorized height controled microscope.
The high-resolution motion control system is precise enough to repeatably deliver less than 1 micron bond shear heights, yet can shear large die up to 200 Kgf (440 lbf). A large 305 x 155-mm servo-driven XY stage permits testing of 300-mm wafers, leadframes, large substrates or PC boards.
Running under Windows XP, the Bond Test Manager control program supports Asian and European languages and offers statistical reporting and analysis with support for corporate databases. The user environment can be controlled by several levels of permissions. The overall system footprint is 560 mm (22 in.) high x 432 mm (17 in.) wide x 585 mm (23 in.) deep.
The System 650 complies with a wide range of industry standards including Mil Std 883, ASTM F 1269, EIAJ ET-7407, JESD22-B117, JESD22-116 CE and is ROHS WEEE compliant.
Product information: System 650
Royce Instruments, www.instruments.com