SAN JOSE, Calif. Japan's Toshiba Corp. said that it plans to boost its competitiveness in the CMOS image sensor sector by bringing in-house the currently outsourced production of CMOS camera modules.
Mass production of new products will start at Iwate Toshiba Electronics, a Toshiba Group company, starting in January of 2008.
Manufacturing will start with the latest addition to Toshiba's Dynastron series of CMOS image sensors. These chip-scale camera modules will be the first camera modules manufactured with through-chip via technology, according to Toshiba (Tokyo).
This technology, in turn, ''reduces wire bonding a substrate area by mounting components directly on the wafer and running electrodes through the vias on the circuit board, securing them with balls of solders on the substrate,'' according to the company.
"In order to meet demand, we will refine our business model by bringing our manufacturing of CMOS camera modules into the group," said Yoshio Ooida, the executive vice president of Toshiba's Semiconductor Company, in a satement. ''We will also further develop the business by increasing sensor manufacturing capacity at Oita Operations."
Separately, Toshiba announced sample availability for the new line of ultra-compact camera modules. This new family of camera modules includes the TCM9200MD, TCM9100MD and the TCM9000MD.
The products deliver an approximate 64 percent reduction in module size in comparison to other modules using the same sensor, according to Toshiba.
Mass production for the TCM9200MD, TCM9100MD and TCM9000MD camera modules is planned for January, February and June 2008 respectively. The
evaluation price in 1,000 unit quantities for the TCM9200MD is $50 each, $40 each for the TCM9100MD and $30 each for the TCM9000MD.