LONDON — Broadcom Corporation has started sampling to selected customers a single-chip HSPA (high-speed packet access) processor that integrates all the key 3G cellular and mobile technologies in a low power, single 65-nm CMOS die.
Dubbed the BCM21551, the device integrates dual ARM11 processors to provide open OS support and features full stereo music capabilities for both headset and stereo speakers, and an integrated 5-band graphic equalizer and digital mixing capabilities for superior audio performance.
The SoC has an HSUPA 3G baseband, multi-band RF transceiver, Bluetooth 2.1 with enhanced data rate (EDR) technology, FM radio receiver and FM radio transmitter, and features multimedia processing, up to 5 Megapixels camera support and 30 frame per second video with "TV Out". There is also support for HSUPA, HSDPA, WCDMA and EDGE cellular protocols.
The chip has a MIPI serial interfaces for the LCD and image sensor and the analog PHY required for the 480Mbits/second USB2.0 applications that enable the rapid transfer of multimedia files to and from the handset.
"We have engineering samples and we anticipate that HSUPA phones targeting the mid-tier price market using the part will be on sale during the first half of 2009," Mike Civiello, senior director of marketing at Broadcom's Mobile and Wireless business unit told EE Times Europe .
Civiello said operators in the Far East, Europe and the U.S. are rolling out network infrastructure as fast as possible to make use of the very high data rates available with HSPA, anticipating huge demand from the "You Tube Generation" downloading ever higher data rate demanding content.
The 21551 – developed under the internal code name Zeus – will allow download at up to 7.2 Mbits/s and upload content such as pictures and videos at up to 5.8Mbit/s. It also uses Broadcom's proprietary M-Stream and single antenna interference cancellation signal processing technologies designed to improve cellular handset reception and voice quality.
The device extends the company's range of single-chip baseband processors for cellular phones made in 65-nm CMOS, the first of which were announced earlier this year at the 3GSM Congress in Barcelona. The series includes the BCM21331 EDGE processor (from the Venus project) that is being used by Nokia in certain of its latest handsets, and the 2153 HEDGE (HSDPA+EDGE) transceiver.