Nashua, N.H. Amphenol TCS has introduced a stacking version of its 20+ Gbits/s XCede backplane connector platform, providing performance headroom for mezzanine card applications. The XCede Stacker will enable parallel board-to-board designs with the same high levels of performance and reliability as the XCede backplane system.
Stacking connectors provide equipment manufacturers with the means to incorporate flexible configurations into their card and system designs. The 4-pair size provides the density and mechanical robustness necessary to address increasing I/O counts. The modular construction of the XCede stacker with different guidance options allows the connector length to be optimized for each application. Several heights are currently available from 22 mm up to 44 mm, making the connector suitable for scaling stackable systems based on 1U increments.
The XCede connector is designed to enable future data rate requirements for datacom, telecom, storage and wireless equipment, meeting and exceeding standards set for Ethernet, SONET/SDH, PCIe, Fibre Channel and Infiniband, while employing a reliable press-fit attachment. An innovative 3D shield technology enables very low crosstalk and incorporates advanced materials to prevent high-frequency resonances.
The XCede family also supports 2-pair (27.5 differential pairs/inch) through 6-pair (82 differential pairs/inch) backplane connector versions and integrated power and guidance.
Amphenol TCS will be exhibiting at DesignCon, February 4-8, 2008.
Pricing: The XCede connector family is available at approximately $0.10 - $0.16 per mated signal line in full production volumes.
Product information: XCede connector platform
Amphenol TCS (ATCS), a division of Amphenol Corp., www.amphenol-tcs.com