Lisle, Ill. Molex Inc. and Neoconix have partnered to deliver a flexible, copper-based high-density and speed (HD&S) interposer. The low-profile contact interface integrates the Copper Flex from Molex with Neoconix's HD&S PC Beam interposer for flex-to-PCBA applications.
The Copper Flex assembly with HS&S PC Beam interposer is suitable for telecommunication, server, mass storage, medical imaging, automatic test equipment (ATEA) and military command and control center markets. The new interface allows differential signal speeds greater than 10 Gbits/s and single-ended speeds of 4 GHz and higher, said Molex. It also offers less than 3 percent cross talk in a pin-matrix configuration, providing high-speed data transmission with minimal interference.
The copper flex assembly offers an impedance matched system that offers 100-ohm differential and 50-ohm single-ended options and board-to-flex pin counts of 500 input/outputs or greater. It offers densities of 1.00 mm (.039 in.) or less in a variety of pin-matrix configurations, and features single-piece compression and tool-less hardware interfaces. They are available in cable lengths of 4 to 28 inches, and are offered in a variety of thicknesses and custom sizes and footprints.
PCBeam interposers feature all-metal spring beams that are permanently embedded onto a FR-4 substrate in a high-density configuration. Photolithography and etch are used to define the contact elements for greater design flexibility and true-position accuracy. Typical configurations provide 0.152 mm (.006 in.) of true electrical compliance (TEC) per side at 1.00-mm (.039 in.) pitch to ensure high reliability. A dual-beam option is also available to provide contact redundancy in high-reliability applications.
Molex will be exhibiting at DesignCon 2008 in booth 511, February 4-7, 2008.
Product information: Copper Flex Assembly
Molex Inc., www.molex.com