San Jose, Calif. Toshiba America Electronic Components, Inc. (TAEC) has unveiled three Dynastron image sensors based on its high-sensitivity pixel technology and two new chip-scale camera modules (CSCMs) that provide a significant reduction in size, enabling OEMs to incorporate high-resolution digital cameras in mobile handsets and integrated cameras for notebook computers.
The three image sensors are all implemented in Toshiba's 1.75-micron pixel technology. These sensors include a 2-megapixel (MP) SoC sensor (1/5-inch optical format), a 3 MP SoC sensor (1/4-inch optical format) and 5 MP CIS sensor (1/3-inch optical format). All three sensors have been designed for high performance in low-light operating conditions.
Backed by Toshiba's through chip via technology to allow mounting and assembly of camera components in the chip wafer during manufacturing, the two new CSCMs offer a savings in overall module size. The two CSCMs include one with a 2MP SoC (optical format 1/5-inch) and one with a 3MP SoC (optical format 1/4-inch).
Both CSCMs feature an integrated image signal processing function to give the modules more digital still capture-type functionality in small form factors. Leveraging Toshiba's image and color calibration tools, these CSCMs are easily configurable.
Pricing: The 2 MP SoC sensor (1/5-inch optical format) is priced at $10 per unit, the 3 MP SoC sensor (1/4-inch optical format) at $15 per unit and the 5 MP CIS sensor (1/3-inch optical format) $20 per unit, all in quantities of 10,000. Contact TAEC at firstname.lastname@example.org for pricing information for the CSCMs.
Availability: All sensors and CSCMs are sampling now.
Product information: CMOS image sensors