Santa Clara, Calif. OnChip Devices has released a wire-bondable miniature silicon chip capacitor that the company claims is the industry's smallest and thinnest, measuring 10 x 10 mils sq. (0.25 x 0.25 mm) with thicknesses as thin as 4 mils (0.1 mm). Other thicknesses of 6 mils and 8 mils are available in this foot print.
Targeted at RF/microwave, multi-chip module and hybrid microelectronics applications, the SiC0101 device is built on silicon with a single wire-bondable pad on the top and (aluminum or gold) metallization on the backside of the chip suitable for epoxy die attach. A layer of silicon nitride dielectric film is sandwiched between these two metal plates to form the capacitor. This dielectric material is said to offer high stability and Q values while exhibiting low temperature and voltage coefficients.
Compared to conventional RF capacitors, the SiC0101 offers extremely stable capacitance over a wide range of frequencies from 1 MHz to several GHz, in addition to ultra-high self-resonant frequency (SRF) and ultra-low equivalent series resistance (ESR), OnChip said. The capacitance value range is 4.7 pF to 22 pF.
Typical applications include voltage-controlled oscillators, filter networks, and matching networks in modules for wireless communications including mobile phones, cordless phones, and global positioning systems.
Pricing: Ranges from $0.01 to $0.02 in quantities of 50,000, depending on capacitance value/tolerance and the chip thickness.
Availability: Available now.
OnChip Devices, www.onchip.com