MUNICH, Germany One day after Infineon had to lower the outlook for its wireless devices business, the company announces the availability of a 3G platform with reduced chip count.
With the product, Infineon goes one step further on its integration roadmap and extends its ARM11-based baseband architecture to HSPA. In order to reduce the chip count from three to two, the company's design engineers integrated the power management functions with the baseband chip. For the RF part, the company uses its SMARTi UE multi-frequency transceiver chip. The platform embraces three family members aiming at different market segments which range from data-only applications to low-cost and midrange 3G mobile phones and supporting data rates of up to 7.2Mbps/2.9Mbps.
Since the platform is based on the same architecture as available solutions, users can reuse their software to a high degree, the company claims. "These platforms enable our customers to fully reuse their hardware and software developments and launch multiple phones covering all feature phone market segments with lower cost and faster time-to-market," said Infineon board member Hermann Eul who oversees the company's communications activities.
The baseband chips are manufactured in 65-nm and packaged in the company's proprietary eWLB package technology which results in particularly small packages. The company plans to supply evaluation boards by end of June; volume ramp-up is scheduled for year's end.
Infineon did not want to say if there are already customers who have signed up to buy the device. A company spokesperson however said that Samsung has announced to use the predecessor generation to the chipset at hand.