PARIS STMicroelectronics NV (Geneva, Switzerland) and Arkados Inc. (Piscataway, New Jersey) have joined forces to develop and manufacture a 200-Mbit per second, HomePlug AV wideband powerline modem system-on-chip (SoC).
ST and Arkados said the codeveloped HomePlug AV SoC aims to power applications ranging from simple Ethernet-to-powerline bridges to full-features products such as HDTV distribution, digital set-top boxes, IPTV, whole-house audio, networked digital picture frames, surveillance systems, as well as industrial and commercial applications.
The HomePlug AV SoC is expected to be available by mid-next year so as to meet the market’s needs for communications solutions that help to implement Smart Grid and Green Energy applications, partners indicated.
Under the terms of the agreement, ST and Arkados said they will market a version of the device aimed at bridging applications such as Ethernet-to-Powerline adapters, or other applications where only a MAC/PHY implementation is required. Then, Arkados said it will focus on marketing the chip for more full-featured connected media applications such as whole-house audio, IPTV, and segments of the smart-grid market.
The agreement also specified that the US-based company will complete the design and manufacturing of the chip. ST has agreed to contribute to the investment for the development and manufacturing of the Arkados-designed chip. In return, the European chipmaker will be entitled to market the chip via its global distribution network.
ST and Arkados specified that the next-generation chip will include support for the Inter PHY Communication Protocol (IPP), currently being defined by the IEEE P1901 Working Group.