Power Integrations has launched five new members of its TOPSwitch-HX family of AC-DC power conversion ICs in the company's new 2-mm-high e-SIP-L package.
The new products are ideal for slim power adapters used with netbook/laptop computers, printers and video game consoles, and for LCD TVs and monitors where the trend recently has been toward lower-profile and more energy-efficient products.
The TOPSwitch-HX family is highly efficient from light load to full power, which benefits a wide range of applications where government regulations limit energy usage at all power levels. The traditional TO-220 power packages previously used for power devices stand 18 mm above the PCB and constrain the heatsink to a vertical aspect that often considerably exceeds this height. Power Integrations' proprietary eSIP package features an 'L' shaped lead-bend enabling the devices to lie flat against the board with the exposed heatsink pad facing upwards. The package leaves plenty of space for a heatsink and enables slender power supply designs.
Andrew Smith, product manager at Power Integrations, said: "Now that these ICs are available in the new low-profile eSIP-L package, power supply designers will be able to reduce size, save cost and still meet all required agency regulations. Moreover, our proprietary high-frequency SlimCore transformer technology - freely licensed to PI customers when they use TOPSwitch-HX in their adapter design - means that very low-profile solutions can be created quickly, easily and economically."
The new eSIP-L package is designed to meet international standards for creepage and clearance, increasing reliability and improving resistance to contaminant-induced short-circuit failures. The new products, TOP255LN, TOP256LN, TOP257LN, TOP258LN and TOP259LN, join the previously released TOP260LN, TOP261LN and TOP262LN and are immediately available from $0.95/each in 10k unit quantities.