MUNICH, Germany - The new ProtoLaser U from LPKF is optimized for UV laser machining of different materials " and has a low entry price. Although it looks very similar on the outside to its twin, the LPKF ProtoLaser S, the hood hides a different laser source with special features of its own: with its UV laser system, the ProtoLaser U can cut, drill and structure almost any kind of material.
The laser system is compact and laboratory-optimised
Whilst the ProtoLaser S and its infrared laser are suited for the structuring of printed circuit boards, the ProtoLaser U's forte is micromachining. And the attractive system price opens up UV laser technology to a bigger circle of users. For instance, the system can depanel individual PCBs from a large printed circuit board in a stress-free and precise process. It can also cut LTCC and prepregs, drill holes and microvias, structure TCO/ITO layers, and open up solder masks. The high pulse energy of the UV laser causes ablation without leaving behind any residues. The result: contours with very accurate geometries. The integrated vacuum table holds flexible and thin substrates safely and firmly in place.
The laser process is controlled by the integrated CircuitCAM software. Optimal parameters are already archived for numerous applications. The special operating mode enables the predefined production processes to be delegated to staff with only a superficial knowledge of laser processing " whilst experienced operators can make use of the whole spectrum of UV laser technology.
The laser system is compact and laboratory-optimised. It is suited for prototyping and the production of mini-series. The working area measures 229mmx305mm, and it only needs one plug socket.