Miniaturisation of electronic circuits is leading to ever more frequent use of surface-mounted devices (SMD). In addition to logic circuitry, more and more of these devices contain triggers and power elements which give rise to increased heat production which has become an increasingly important factor.
In order to dissipate the heat from these SMDs, Fischer Elektronik have developed various aluminium heatsinks of the ICK-SMD series, the dimensions of which match a large range of current IC case designs
The low overall height of these heatsinks and their low weight make them ideally suited for use on surface-mounted devices.
The heatsinks are fastened onto the SMD using thermally conductive, double sided adhesive tape or 2-component thermally conductive adhesive.
In addition to the versions with a black anodised surface, solderable surfaces are available allowing these small heatsinks to be soldered onto existing copper surfaces on the PCB such as an SMD, thus allowing dissipation of the heat. Therefore, various designs are available on tape and reel for automatic processing.
In addition to standard heatsinks, specially modified and customized versions are developed and manufactured. For any enquiries or further details, please contact the Fischer Elektronik product specialists.
Current product data sheets and samples are available. For enquiries and further details, please contact the Fischer Elektronik product specialists. They will be pleased to give you any advice you may require.
Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.
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