Sigrity unveiled a new version of its XtractIM product that allows package designers to assess performance of signal and power delivery nets intuitively, characterize a broader set of package types, and extract electrical models with improved accuracy.
According to Sigrity its XtractIM 3.0 has the following enhancements suggested by engineers at Altera and Qualcomm:
a practical assessment method for complex SiP power delivery nets, and support for single-die packages
electrical performance assessment capabilities has a new signal net assessment analysis and results display
supports quad flat pack (QFP), quad flat pack no leads (QFN), and VQFP
refined analysis engine component models for vias, pads and traces in support of single-segment RLGC or IBIS models.
With XtractIM, users can observe both die- and board-side package issues, including places where the design may not meet specified per-pin resistance and inductance.
XtractIM goes beyond typical extraction to provide novel power/ground assessment capability with automated results that correspond to the specifications provided by IC design teams.
The initial release of XtractIM in October 2006 provided more than a 10-times speedup for package model extraction. It further delivered a new level of capacity to consider the full package in a single analysis, according to the company.
XtractIM 3.0 is now available for download by existing XtractIM users.