Toshiba Electronics Europe has unveiled a new deserializer display bridge chip that connects the baseband or application processors used in smart phones, which use Mobile Industry Processor Interface-Display Serial Interfaces (MIPI-DSI), to displays with legacy parallel interfaces.
The capability of the TC358762XBG allows OEMs to implement the power of an advanced mobile processor in other mobile applications beyond smart phones where high-resolution displays with parallel interfaces are more commonly used. The deserializer bridge chip, along with three other bridge chips, is the latest addition to the Toshiba Mobile Product Initiative portfolio of mobile peripheral devices designed to help customers implement more advanced technologies in their handheld products.
Toshiba's mobile peripheral devices are connectivity chipsets that enable flexibility in mechanical design, a broader selection of major components such as displays and cameras, reduction in power consumption, and reduction in EMI issues in handheld devices such as smart phones, mobile internet devices, netbooks, smartbooks, eBooks, and personal media and navigation devices. The TC358762XBG deserializer bridge chip uses the MIPI high-speed serial interface to deliver the large data bandwidth needed for displaying high-resolution video content.
The TC358762XBG deserializer bridge chip is targeted for use with high-resolution display panels HVGA, VGA, WVGA, qHD, and XGA. The chip supports video input frame rates of up to 60 frames per second for XGA and 30 frames per second for 720P. It uses a dual-lane DSI receiver that is bi-directional at lane 0 and supports data rates of up to 800 Mbps per lane for total data bandwidth of 1.6Gbps. The chip's DPI (display port interface) host has a bus speed of up to 70 MHz burst rate. The device can also be used to connect pico projectors to baseband and application processors to enable embedded digital projector applications in mobile devices.
Engineering samples of the TC358762XBG deserializer bridge chip are available now, with mass production scheduled to begin in March 2010.