PARIS STMicroelectronics announced its 55 nanometer embedded flash (eFlash) process technology, which will be implemented in the company's next-generation automotive microcontroller chips.
ST is extending its production of eFlash technology to this advanced process node at its world-class 300mm manufacturing facility at Crolles, France.
The 55nm eFlash technology is the continuation of the company's successful 90nm eFlash automotive microcontroller family.
Automotive market demands are driving the technology beyond the performance currently delivered by 90nm-based chips.
Next-generation automotive systems will increasingly require MCUs with more computational performance, better power efficiency and greater memory content to meet market requirements in automotive applications, such as functional safety, tougher emission standards or ADAS (Advanced Driver-Assistance Systems) solutions.
The new technology will enable ST to provide substantial performance improvement and greater value to its customers and will be the basis for ST's future automotive 32-bit Power Architecture-based MCU roadmap.
The eFlash technology has been developed and will be manufactured at the company's†Crolles facility, which is automotive certified.
At Crolles, ST is in production with 55nm technology for automotive products and has already produced several fully working embedded Flash technology test vehicles implementing key automotive system IP.
First 55nm embedded-Flash product is expected to be available for customer sampling in mid-2011, and automotive qualification in 2013.†
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