Taipei, Waiwan - VIA Technologies, Inc, is offering device development kits for the VIA AMOS-5000 series. The kits are designed to facilitate a more rational and efficient design infrastructure for a broad range of application-specific, fanless Em-ITX-based devices.
VIA AMOS-5000 series development kits combine application-specific VIA EM-IO expansion modules with specially designed extendable aluminum chassis kits. This allows embedded OEM and ODM customers to quickly develop a variety of fanless embedded box systems suited to a wide range of applications.
Featuring the VIA EMIO-3110 module, the VIA AMOS-5110 kit features advanced graphics and video processing with a dedicated DirectX 10.1 S3 Graphics 4300E graphics processor and 256MB of GDDR3 memory. The kit supports VGA, dual DVI and dual HDMI display ports that offer up to six independently configurable displays with up to four separate content streams. It includes TV Out, 8-channel HD audio, and hardware accelerated HD video decoder
VIA AMOS-5110 is targeted for advanced digital signage, POI and gaming applications. Optional chassis support includes dual 2.5" SATA drive bay.
For more information on the VIA AMOS-5110 visit www.via.com.tw/.
Using the VIA EMIO-3430 module, the VIA AMOS-5430 is designed specifically for modern vehicle, fleet management, and logistics infrastructures. The kit includes an expansive array of connectivity options, including a 20-channel GPS receiver, Bluetooth Class 2, and Wireless LAN 802.11 b/g. A PC card is included to offer further connectivity support through Cardbus (Card-32) and 16-bit (PCMCIA 21.1/JEDIA 4.2) cards.
Chassis customization includes supports for 2.5" hard drive bay with optional support for up to two additional SATA drives through storage bay chassis module.
The VIA AMOS-5210 kit incorporates the VIA EMIO-3210 module and is designed for industrial factory automation applications. The kit features a dedicated LPC super I/O controller providing six COM ports configurable with RS-232/422/485, 9-pin D-sub configurable connectors, and two parallel ports. The VIA AMOS-5210 is shock- and vibration-proof to up to 50Gs and 5Grms. It is table and wall mountable.
For more information on the VIA AMOS-5210 device development kit visit www.via.com.tw.
The VIA AMOS-5000 series is based on the VIA EITX-3000 which uses the Em-ITX specification and is suitable for a range of ultra-thin embedded applications. The 64-bit VIA Nano processor and versatile VX800 media system processor combine to offer a potent range of I/O configurations as well as superscalar performance and software virtualization support.
The Em-ITX form factor is quickly maturing industry standard defined by VIA, and is 30 percent more compact than Mini-ITX, yet offers 200% more I/O real estate. At 12cm x 17cm, the Em-ITX form factor includes unique dual I/O coastlines and an exclusive Em-IO expansion bus to bring unrivalled flexibility and scalability.
All VIA EMIO expansion modules work seamlessly with the VIA EITX-3000. For more information on the VIA EITX-3000 board visit www.via.com.tw.
For more information about the Em-ITX form factor visit www.via.com.tw.
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