Dallas, Tex. - Texas Instruments Incorporated offers free Windows Embedded CE 6.0 R3 board support packages (BSPs) for OMAP-L1x floating-point DSP+ARM9 processors, Sitara AM1x ARM9 microprocessor units (MPUs), and associated evaluation modules (EVMs). The BSPs include well-tested drivers and source code, enabling developers to easily and quickly interface the supported devices to the operating system. They also provide drivers and protocol stacks necessary for many of the chipsí integrated peripherals, such as Ethernet, USB, CAN, SATA, LCD and touch screen controllers.
For OMAP-L1x devices, the BSP provides access to TIís TMS320C674x DSP using DSP/BIOS Link inter-processor communication software. DSP/BIOS Link enables developers to easily access the DSP for algorithm development using Windows Embedded CE 6.0 R3.
The OMAP-L1x and AM1x board support packages are compatible with the following TI processors and associated EVMs:
- OMAP-L137 processor
- OMAP-L138 processor
- AM1707 microprocessor
- AM1808 microprocessor
- AM17x Evaluation Module
- AM18x Evaluation Module
- AM18x Experimenterís Kit
- OMAPL137/C6747 Floating Point Starter Kit
- EVM OMAP-L138 Experimenter Kit
Windows Embedded CE 6.0 R3 board support packages for OMAP-L1x and AM1x devices are available for free download at www.ti.com/wincebsp-prtf
TI is expanding its list of product lines already supported by Windows CE BSPs, including Sitara AM3517 and AM3505 MPUs, DaVinci DM644x video processors and several OMAP35x devices. For more information or to download CE BSPs for other TI devices, visit www.ti.com/wincebsp-prlp.