Dolphin Integration SA and TexEDA Design Inc. said they have joined forces to integrate their respective solutions for logic and mixed simulation and for custom IC design to enable a complete and consistent flow.
Ultimately, partners said they aim to yield a comprehensive route to accurate logic, analog and mixed-signal design.
The integration is presented as follows.
LaySim is part of TexEDA's LayTools IC design suite and is presented as either a comprehensive device-level simulator (Spice compatible) or as a mixed-mode solution, adding Verilog-HDL structural and behavioral support. LaySim is now powered by SMASH kernel developed by Dolphin Integration.
Dolphin Integration and TexEDA said they intend to pursue their collaboration in a view to provide users with "the tightest interfaces between circuit design and implementation modules."
LayTools is available under Windows and Linux.
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