Dolphin Integration SA and TexEDA Design Inc. said they have joined forces to integrate their respective solutions for logic and mixed simulation and for custom IC design to enable a complete and consistent flow.
Ultimately, partners said they aim to yield a comprehensive route to accurate logic, analog and mixed-signal design.
The integration is presented as follows.
LaySim is part of TexEDA's LayTools IC design suite and is presented as either a comprehensive device-level simulator (Spice compatible) or as a mixed-mode solution, adding Verilog-HDL structural and behavioral support. LaySim is now powered by SMASH kernel developed by Dolphin Integration.
Dolphin Integration and TexEDA said they intend to pursue their collaboration in a view to provide users with "the tightest interfaces between circuit design and implementation modules."
Join our online Radio Show on Friday 11th July starting at 2:00pm Eastern, when EETimes editor of all things fun and interesting, Max Maxfield, and embedded systems expert, Jack Ganssle, will debate as to just what is, and is not, and embedded system.