Mentor Graphics today released a new version of its FloTHERM 3D computational fluid dynamics software with features that allows engineers to identify where and why heat flow bottlenecks occur and how designers might fix the problem.
FloTHERM v.9 software tool added Bottleneck (Bn) and Shortcut (Sc) that move its thermal analysis offering from observation tool to one that suggests solutions, the company said.
While designers today have a number of thermal analysis tools at their disposal, often they must extrapolate the causes of the thermal bottlenecks and then prototype fixes to the problem, which is costly and takes time.
(The importance of thermal analysis is widely accepted, but the video below illustrates the consequences).
Bn field identifies flow paths that carry high heat but resist the flow of that heat
Sc field highlights possible solutions, such as a gap pad or other design approach
Accommodates XML and geometry data imports
Interfaces directly to Mentor’s Expedition PCB design platform
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