Master Bond Inc. announced its Low Thermal Expansion Epoxy, EP30LTE-LO, has passed the NASA low outgassing tests.
Master Bond EP30LTE-LO is a two component epoxy system with very low shrinkage, high dimensional stability and a low coefficient of thermal expansion. This system has passed ASTM 595 for low outgassing, allowing EP30LTE-LO to be used as a sealant or encapsulant in applications requiring vacuum compatibility. It has wide applicability as a high performance adhesive, sealant and casting compound in the electrical, electronic, optical, aerospace and chemical industries.
EP30LTE-LO has a 10 to 1 mix ratio by weight. The system cures at room temperature or faster at elevated temperatures. Other noteworthy properties include a CTE of 12x10-6 in/in/°C, a linear shrinkage of 0.0002 in/in, a thermal conductivity of greater than 5 BTU•in/ft²•hr•°F, and a wide service temperature range of -60 to 250°F. EP30LTE-LO is an excellent electrical insulator, has superior chemical resistance, and bonds readily to a wide variety of similar and dissimilar substrates including metals, plastics, ceramics and glass. It is available in half-pint, pint, quart, gallon and 5 gallon container kits.
The EP30LTE-LO version features the same physical properties as the regular EPO30LTE, except the viscosity is around 30,000 cps.