ON Semiconductor has released a new device for integrated
electrostatic discharge (ESD) protection for use in notebooks, tablets,
and external storage devices.
The new ESD7004 is specifically designed to preserve signal integrity in
high speed applications such as USB 3.0 (5 gigabits per second, Gb/s)
and eSATA (up to 6 Gb/s). The device breaks the current industry
capacitance barrier offering an ultra low 0.4 pF rating, while
maintaining low ESD clamping voltage.
As high speed interfaces exceed 5 Gb/s, a few tenths of a picofarad
capacitance can have a major effect on the signal integrity of the data
being transmitted. By lowering the capacitance down to 0.4 pF typical,
0.5 pF maximum, the ESD7004 offers an ESD protection solution that has
virtually no effect on eye diagrams of USB 3.0 at 5 Gb/s and eSATA at 6
Gb/s. In addition, these parts maintain less than 1 db insertion loss at
over 8 GHz during S21 measurements, ensuring negligible effect on high
speed data transmission.
Utilizing ON Semiconductor's patented ESD protection silicon which
incorporates innovative isolation techniques, the ESD7004 offers
extremely low clamping voltages and fast response time during ESD
events. These designs boast clamping voltages at 11.4 V or less during
Transmission Line Pulse (TLP) ±8 amperes (A) testing which safeguards
chipsets using small geometries and low voltage tolerances, common for
high speed datalines. An ESD rating of 15 kV contact per the
IEC61000-4-2 standard and low turn on resistance during ESD events
ensures that the most sensitive chipsets will be safe from ESD threats.
This ESD7004 is offered in the uDFN 2.5 mm x 1.0 mm x 0.5 mm 10-pin
package which integrates four lines of protection in a flow through
routing pinout that enable board designers to route traces easily with
minimal impact to impedance matching. Budgetary pricing for this device
is $0.097 per unit in 10,000 unit quantities.
Datasheet: Click here.
Visit ON Semiconductor at www.onsemi.com.
article originally appeared on EE Times Europe.