STMicroelectronics' Sound Terminal digital audio SoC supports up to 50W of output power, without requiring any external heatsink. The STA350BW has digital audio processing on the chip and features performance enhancing innovations pioneered by ST such as Multiband Dynamic Range Compression (MDRC), which boosts audio clarity and system reliability.
The SoC is also able to compensate non-ideal speaker characteristics. Enhancements introduced in this generation include optimized low-frequency response for outstanding bass performance. In addition, integrated protection features safeguard the system against a wide range of fault conditions. Run-time automatic diagnostic circuitry helps prevent failures and boosts the overall reliability of the applicatio.
The IC's power stage uses ST's FFX technology to stream full digital audio to the speakers. This maximizes flexibility for configurable products by providing four selectable run-time output configurations supporting a choice of operating modes including 2.0, 2.1 or 1.0 channel, or 2.0-channel with a PWM output for an external subwoofer. The IC comes in a PowerSSO 36-pin slug-down package supporting convenient low-cost system design
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This article originally appeared on EE Times Europe.