TE Connectivity (TE), formerly Tyco Electronics, has developed a surface-mount LGA 2011 socket specifically for Intel Corp.ís Core i7 and Xeon 5 CPU processors.
The contacts of TEís new LGA 2011 socket include solder balls for surface-mounting onto a printed circuit board (PCB). The product's hex-ball array provides stronger housing and minimizes the space that the 2011 balls occupy. The socket features an integrated lever mechanism (ILM) that generates the Z-axis compression load and its bolster plate limits PCB bowing during compression.
The product is available in either 15u" or 30u" gold contact plating for enhanced product performance. TE provides a complete socket and hardware system, while the ILM and backer plate must be ordered separately.
Pricing: There are two parts: the 1554653-1and 1-1554653-1 cost $12 and $14, respectively, in 1k quantities.
Datasheet: Click here