Silicon Line GmbH recently started to sample the SL82027 and SL82017 optical media converter (OMC) ICs targeted at mobile and smart phones using the latest MIPI Alliance based M-PHY standard. The ICs are used to optically connect cameras, displays and application processors and enable the replacement of traditional electrical connectors with optical connectors.
Strong consumer demand for full HD video cameras, 3D cameras, high resolution and 3D displays is driving the data rates inside a phone ever higher. These extremely high data rates not only generate significant EMI when traditional electrical cables are used to transport the data but also are reaching the limits of the capabilities of electrical cables. Recognizing these challenges, the standard creating organization within the mobile phone industry, the MIPI Alliance, has defined a high speed physical layer called M-PHY and has created a standard for how to transport M-PHY signals optically.
An SL82027 and SL82017 based OMC can be used to connect an application processor to a camera module in order to transmit high speed image data to the application processor using the future MIPI Alliance CSI-3 (Camera Serial Interface) standard. Such an OMC can also be used to transmit image data from the application processor to the display using the future MIPI next generation display interface standard.
The SL82027 vertical cavity surface emitting laser (VCSEL) driver and the SL82017 transimpedance amplifier (TIA) together with appropriate photonics are used to implement a MIPI compliant Basic OMC for transporting M-PHY signals. Both devices include special circuits which handle the M-PHY specific protocol and process both the high speed and low speed signals. Data transmission is done optically over a fiber in the case of high speed data and low speed data is transmitted over an auxiliary galvanic interconnect.
The devices support both the MIPI M-PHY defined low speed PWM-BURST mode up to PWM Gear 7 and also the high speed HS-BURST mode up to Gear 2.