Winbond Electronics Corp. announced a family of new SpiFlash Serial Flash memories, claiming that it offers the industry's smallest packages per density.
Applications include space-critical designs, such as smart phones, Bluetooth headsets, cameras, digital video, gaming, GPS, wireless modules and other mobile/handheld products. With minimal package dimensions as small as 3.4mm2, the devices meet the space-saving needs of the rapidly growing mobile-computing market with a range of densities from 512K-bit to 16M-bit.
Available in eight-pin ultra-thin small-outline no-lead (USON) and wafer-level-ball-grid-array (WLBGA) forms, the new SpiFlash memories occupy less than 20 percent of the space used by ordinary 30mm2 WSON and SOIC packages, according to Winbond.
The new USON 6mm2 (2 x 3 x 0.55mm) SpiFlash memories come in densities of 512Kb, 1Mb, 2Mb, 4Mb and 8Mb in 2.5V or 3V versions; power-saving 1.8V versions are also available for 2Mb and 4Mb densities. The 8Mb USON is the industry's highest density available in such a package. The WLBGA devices, which use a Wafer-Level-Chip-Scale-Packages (WLCSP) assembly process, are available in 8Mb (3.4mm2) and 16Mb (4.8mm2) densities that operate at 1.8V. The WLBGAs are 0.47mm in height and use 11 percent and 16 percent the space, respectively, of a WSON or SOIC package. The WLBGA packages also provide design security by preventing access to the chips' signals once mounted to PCBs.
Winbond's W25X (Single & Dual SPI) and W25Q (Single, Dual and Quad SPI), USON devices are sampling now, with some versions in full production, and priced from $0.32 to $0.57 in 10,000 unit quantities. The W25Q80BWBYIG (8Mb) and W25Q16DWBYIG (16Mb) WLBGA devices are in production now and priced from $0.68 to $0.97 in 10,000 unit quantities.