Molex is assuring designers of mobile devices that it can provide stable signal connections with its latest interconnects: the SlimStack B8 connectors, which feature a robust housing and unique CleanPoint contact for removing flux and other contaminants to provide superior electrical reliability.
Compact SlimStack B8 0.40mm pitch SMT board-to-board connectors, with a 0.80mm height and ultra-narrow 2.50mm width, afford maximum space savings in high end medical, consumer electronics and data/telecom mobile device applications.
Leveraging the strengths of the Molex SlimStack portfolio, the B8 version includes a new patent pending CleanPoint contact design with a beveled shape for a wider, more uniform cleaning path and a more stable signal than other connectors for mobile applications. The CleanPoint contact and redundant dual-contact terminal helps to ensure a secure contact and to avoid drop-shock continuity in the event of falls or rough handling.
The SlimStack B8 assembly method, including a top housing-wall (stopper) design with a rugged metal cover, more effectively protects the terminal from damage due to "zippering" or forcible angled unmating. The metal cover-nail protects the housing from damage during angled unmating or blind mating. Mating tests on the outer wall of SlimStack B8 connectors demonstrate no damage to the housing with up to 50N applied force and 0.80mm displacement. Reliable mechanical features enable easy use, such as a tactile click when mating and strong retention forces for further contact stability.
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