A family of serial flash memory devices brings new storage options to the automotive-electronics market. The SpiFlash from Winbond Electronics Corp. features densities from 2 Mb to 128 Mb.
The ISO/TS16949-certified devices include the 90-nm Automotive Grade 2 (-40°C~105°C) and Automotive Grade 3 (-40°C~+85°C) memories available in densities up to 128 Mb. Additionally, Industrial Grade Plus targets less stringent automotive applications. Later in 2012, Winbond will unveil a 58-nm family of SpiFlash starting with densities up to 256Mb, as well as 90-nm parallel NOR flash memories, also up to 256Mb.
"The global automotive semiconductor market is growing at 10% compound annual growth rate, thanks to a combination of increased electronics penetration per vehicle, the growing sophistication of system control, and emerging market production," says Chris Webber, vice president, Global Automotive Practice at Strategic Analytics. "In many embedded automotive electronics applications, flash memory demand is increasing due to higher processor performance plus code and data expansion."
Automotive systems that take advantage of serial flash memories include audio, telematics, navigation/GPS, media centers, digital displays, cameras, data recorder, and safety-monitoring devices. For more information, visit www.winbond.com
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