A family of DDR3L memory modules features an ultra-low profile for communications and networking applications. The Blade VLP modules from Virtium are available now in 4-GB and 8-GB densities in a wide range of ECC SODIMM, RDIMM, UDIMM, and Mini DIMM configurations. By reducing the height from the JEDEC-standard VLP of 18.75 mm to 17.78-mm profile, the modules present a good solution for telecom and networking applications in which it is difficult to accommodate the memory required for both an industry-standard DIMM or Mini DIMM socket plus a standard VLP at the 18.75 mm height.
Virtium's low power DDR3L memory modules are designed to reduce the total power in systems that use multiple memory modules and those that must run at higher temperatures, which is a typical design challenge in a wide range of AdvancedTCA-based telecom and Ethernet blade switch networking applications. The reduced form factor not only solves space constraints allowing more air flow in the system, but also boosts system performance by incorporating low power DRAM that reduces thermal dissipation by up to 10°C on the DRAM surface. This is a particular design advantage as JEDEC specifies that systems running memory beyond 85°C must double the memory self-refresh rate.
For more information, visit Virtium’s website.